Umamaheswara Rao Tida
Abstract
There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implementing on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Thus, we propose using through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to implement on-chip inductors for DC-DC converters. While existing literature show that TSV inductors are inferior compared with conventional spiral inductors due to substrate loss for RF applications, in this article, we demonstrate that it is not the case for DC-DC converters, which operate at relatively low frequencies. Experimental results show that by replacing conventional spiral inductors with TSV inductors, with almost the same efficiency and output voltage, up to 4.3× and 3.2× inductor area reduction can be achieved for the single-phase buck converter and the interleaved buck converter with magnetic coupling, respectively.
- X. Bian, H. Guo, L. Zhang, K. H. Tan, and C. M. Lai. 2012. Simulation and modeling of wafer level silicon-base spiral inductor. In Proceedings of the 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP). 29--31.Google Scholar
- Y. I. Bontzios, M. G. Dimopoulos, and A. A. Hatzopoulos. 2011. Prospects of 3D inductors on through silicon vias processes for 3D ICs. In Proceedings of the IEEE/IFIP International Conference on VLSI and System-on-Chip (VLSI-SoC). 90--93.Google Scholar
- Y. Choi, N. Chang, and T. Kim. 2007. DC-DC converter-aware power management of low-power embedded systems. IEEE Trans. Comput. Aid. Des. Integr. Circuits Syst. 26, 8, 1367--1381. Google ScholarDigital Library
- Z. Feng, M. R. Lueck, D. S. Temple, and M. B. Steer. 2012. High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits. IEEE Trans. Microwave Theory Techn. 60, 7, 2066--2072.Google ScholarCross Ref
- P. D. Franzon, W. R. Davis, and T. Thorolffson. 2010. Creating 3D specific systems: Architecture, design and CAD. In Proceedings of the Design, Automation and Test in Europe Conference & Exhibition (DATE). 1684--1688. Google ScholarDigital Library
- D. Huang and M.-C. F. Chang. 2007. Interleaved three-dimensional on-chip differential inductors and transformers. U.S. Patent WO2007019280. Filed August 2, 2006, Issued February 15, 2007.Google Scholar
- K. Salah, A. El Rouby, H. Ragai, and Y. Ismail. 2012. A closed form expression for TSV-based on-chip spiral inductor. In Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS). 2325--2328.Google Scholar
- U. Tida, C. Zhuo, and Y. Shi. 2013. Through-silicon-via Inductor: Is it real or just a fantasy? In Proceedings of the Asia and South Pacfic Design Automation Conference. 837--842.Google Scholar
- G. VanAckern. 2011. Design guide for CMOS process on-chip 3D inductor using thru-wafer vias. Master's Thesis. Boise State University.Google Scholar
- M. Wang. 2010. Integrated power inductors in silicon for compact DC-DC converters in portable electronics. Ph.D. Dissertation, University of Florida.Google Scholar
- J. Wibben and R. Harjani. 2008. A high-efficiency DC-DC converter using 2 nH integrated inductors. IEEE J. Solid-State Circuits 43, 4, 844--854.Google ScholarCross Ref
- C. P. Yue and S. S. Wong. 1998. On-chip spiral inductors with patterned ground shields for Si-based RF ICs. IEEE J. Solid-State Circuits 33, 5, 743--752.Google ScholarCross Ref
- J. Zhang. 2009. Inductor with patterned ground plane. U.S. Patent US20090250262 A1. Filed April 3, 2008, Issued October 8, 2009.Google Scholar
- B. Zhang, Y.-Z. Xiong, L. Wang, S. Hu, J. Shi, Y.-Q. Zhuang, L.-W. Li, and X. Yuan. 2010. 3D TSV transformer design for DC-DC/AC-DC converter. In Proceedings of the 60th Electronic Components and Technology Conference (ECTC). 1653--1656.Google Scholar
- X. Zhao, M. Scheuermann, and S. K. Lim. 2012. Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs. In Proceedings of the 49th ACM/EDAC/IEEE Design Automation Conference (DAC). 157--162. Google ScholarDigital Library
Index Terms
- Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs
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