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On thermal effects in deep sub-micron VLSI interconnects

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Published:01 June 1999Publication History
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References

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          cover image ACM Conferences
          DAC '99: Proceedings of the 36th annual ACM/IEEE Design Automation Conference
          June 1999
          1000 pages
          ISBN:1581131097
          DOI:10.1145/309847

          Copyright © 1999 ACM

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          • Published: 1 June 1999

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