Abstract
A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time‐dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler‐Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components. © 1999 The Electrochemical Society. All rights reserved.