Abstract
In situ current density mapping, scanning electron microscopy, and energy dispersive spectroscopy were used to study the effects of cerium as a corrosion inhibitor for an aluminum copper alloy (Al 2024‐T4) in chloride containing solutions. It was found that cerium inhibits corrosion of this alloy by reducing the rate of the cathodic reaction. This was due to the formation of cerium‐rich films over copper containing intermetallics which act as local cathodic sites. Results from tests carried out on an aluminum/copper galvanic couple, which was used to simulate the electrochemical behavior of the copper containing intermetallics, showed that corrosion inhibition was associated with the formation of a Ce‐rich film over the copper in agreement with that observed for the alloy.