Abstract
We have fabricated Si (100) membranes about 2 μm thick by several different techniques using open‐circuit and biasing potentials with high molarity aqueous 
solutions. These membranes are characterized by visible‐infrared transmittance and reflectance, scanning with focused Ar+ ion laser beam, and by Raman scattering in order to access thickness uniformity, roughness and strain properties. These techniques may lead to better control of membrane structure for masked ion beam and x‐ray lithography applications.