Abstract
Thermally activated decomposition of the vapor phase of copper (II) hexafluoroacetylacetonate was studied. It was found that the temperature at which the decomposition is carried out influences dramatically the chemical composition of deposits; the higher the temperature, the more carbon is incorporated. Pure copper deposits having resistivities of 3–7 μΩ cm were obtained at substrate temperatures of 340°–390°C. It is believed that in this temperature range, breaking of the metal‐ligand bond of the copper compound takes place while at higher temperatures the onset of the ligand decomposition itself becomes significant. The vapor pressure of liquid copper (II) hexafluoroacetylacetonate was determined over the temperature range 97°‐120°C. The standard enthalpy of evaporation was found to be 
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