AL/Si and Al/Poly‐Si Contact Resistance in Integrated Circuits

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© 1977 ECS - The Electrochemical Society
, , Citation H. M. Naguib and L. H. Hobbs 1977 J. Electrochem. Soc. 124 573 DOI 10.1149/1.2133353

1945-7111/124/4/573

Abstract

This paper presents results on the effects of sintering temperature, sintering time, and contact geometry on Al/Si and Al/poly‐Si contact resistance. At sintering temperatures >450°C the resistance of p‐type contacts is virtually constant and independent of time. The resistance of n‐type contacts, particularly to poly‐Si, increases with increasing sintering temperature for . This is attributed to the precipitation of a p‐type (Al‐doped) layer on n‐contacts during sintering. The interface resistance of both Al/Si and Al/poly‐Si contacts is independent of the length of the contact and inversely proportional to the width of the contact.

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