Abstract
A novel six-degrees-of-freedom (six-DOFs) alignment technique for assembling two-dimensional array components is presented. The technique uses off-axis linear Fresnel zone plates on one component that are combined with alignment targets on the other. The technique is compact and sensitive to all six DOFs; it was used to package an array of microlenses with a 32 × 32 array of GaAs multiple-quantum-well modulators flip-chip bonded to a 9 mm × 9 mm complementary-metal-oxide-semiconductor chip. By use of interference fringes to control the tilt misalignment, the worst-case misalignment of the microlenses relative to the chip is calculated to be as follows: lateral = 3.0 µm, rotational = 0.023°, longitudinal = 13 µm, and tilt = 0.022°. We also propose alternative implementations of the technique, including one that uses on-chip photodetectors to automate this six-DOF alignment technique.
© 2001 Optical Society of America
Full Article | PDF ArticleMore Like This
Marc Châteauneuf and Andrew G. Kirk
Appl. Opt. 43(13) 2689-2694 (2004)
Marc Châteauneuf, Andrew G. Kirk, David V. Plant, Tsuyoshi Yamamoto, and John D. Ahearn
Appl. Opt. 41(26) 5552-5561 (2002)
Zbigniew Jaroszewicz, Vicente Moreno, and Salvador Bara
Appl. Opt. 29(31) 4614-4617 (1990)