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Conferences > OFC > 2014 > Th1C > Th1C.1

A Path to 300 mm Hybrid Silicon Photonic Integrated Circuits

J. E. Bowers, J. T. Bovington, A. Y. Liu, and A. C. Gossard

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Abstract

We describe recent advances in hybrid silicon components and photonic integrated circuits. We present a path towards scalable, ultralow cost photonic integrated circuits (PICs) on 300 mm silicon substrates.

© 2014 Optical Society of America

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