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An investigation of the creep processes in tin and aluminum using a depth-sensing indentation technique

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Abstract

Constant load creep experiments were conducted using a depth-sensing indentation instrument with indentation depths in the submicron range. Experiments were conducted on polycrystalline Sn and sputtered Al films on Si substrates. The results show that the plastic depth versus time curves and the strain rate versus stress plots from these experiments are analogous to those obtained from conventional creep experiments using bulk specimens. The value of the stress exponent for Sn is close to the reported values from uniaxial creep tests. Tests on Al films showed that the stress exponent is dependent on the indentation depth and is governed by the proximity to the film/substrate interface. Load change experiments were also performed and the data from these tests were analyzed. It is concluded that indentation creep experiments may be useful in elucidating the deformation properties of materials and in identifying deformation mechanisms.

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References

  1. Μ. Α. Korhonen, W. R. LaFontaine, C. A. Paszkiet, R. D. Black, and Che-Yu Li, in Thin Films: Stresses and Mechanical Properties II, edited by M. F. Doerner, W. C. Oliver, G. M. Pharr, and F. R. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 159.

  2. W. R. LaFontaine, B. Yost, R. D. Black, and Che-Yu Li, in Thin Films: Stresses and Mechanical Properties II, edited by M. F. Doerner, W. C. Oliver, G. M. Pharr, and F. R. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 165.

  3. W. C. Oliver, C. J. McHargue, and S. J. Zinkle, Thin Solid Films 153, 185 (1987).

    Article  CAS  Google Scholar 

  4. D. Stone, W. R. LaFontaine, P. Alexopoulos, T-W. Wu, and Che-Yu Li, J. Mater. Res. 3, 141 (1988).

    Article  CAS  Google Scholar 

  5. T-W. Wu, Thin Films: Stresses and Mechanical Properties II, edited by M. F. Doerner, W. C. Oliver, G. M. Pharr, and F. R. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 191.

  6. M. J. Mayo, R. W. Siegel, A. Narayanasamy, and W. D. Nix, J. Mater. Res. 5, 1073 (1990).

    Article  CAS  Google Scholar 

  7. S. N. G. Chu and J. C. M. Li, J. Mater. Sci. 12, 2200 (1977).

    Article  CAS  Google Scholar 

  8. S. N. G. Chu and J. C. M. Li, Mater. Sci. and Eng. 45, 167 (1980).

    Article  Google Scholar 

  9. S. N. G. Chu and J. C. M. Li, Mater. Sci. and Eng. 39, 1 (1979).

    Article  CAS  Google Scholar 

  10. S-P. Hannula, D. Stone, and Che-Yu Li, in Electronic Packaging Materials Science, edited by E. A. Giess, K-N. Tu, and D. R. Uhlmann (Mater. Res. Soc. Symp. Proc. 40, Pittsburgh, PA, 1985), p. 217.

  11. T. W. Wu, M. Moshref, and P. S. Alexopoulos, Thin Solid Films 187, 295 (1990).

    Article  CAS  Google Scholar 

  12. W. R. LaFontaine, B. Yost, R. D. Black, and C-Y. Li, J. Mater. Res. 5, 2100 (1990).

    Article  Google Scholar 

  13. M. J. Mayo and W. D. Nix, Strength of Metals and Alloys, edited by P. O. Kettunen, T. K. Lepistö, and M. E. Lehtonen (Pergamon, Oxford, 1988), p. 1415.

  14. W. D. Nix, Metall. Trans. 20A, 2217 (1989).

    Article  Google Scholar 

  15. M. F. Doerner and W. D. Nix, J. Mater. Res. 1, 601 (1986).

    Article  Google Scholar 

  16. J. Pethica, R. Hutchings, and W. C. Oliver, Philos. Mag. A 48, 593 (1983).

    Article  CAS  Google Scholar 

  17. C. N. Ahlquist and W. D. Nix, Scripta Metall. 3, 679 (1969).

    Article  Google Scholar 

  18. R. Horiuchi and M. Otsuka, Trans. Jpn. Inst. Metal. 13, 284 (1972).

    Article  Google Scholar 

  19. F. A. Mohammed, K. L. Murty, and J. W. Morris, Metall. Trans. 4, 935 (1973).

    Article  Google Scholar 

  20. W. D. Nix and B. Ilschner, Strength of Metals and Alloys, edited by P. Haasen, V. Gerold, and G. Kostorz (Pergamon Press, Oxford, 1979), Vol. 3, p. 1503.

  21. H. M. Hawthorne and J. N. Sherwood, Trans. Faraday Soc. 66, 1792 (1970).

    Article  CAS  Google Scholar 

  22. R. E. Frenkel, O. D. Sherby, and J. E. Dorn, Acta Metall. 3, 470 (1955).

    Article  CAS  Google Scholar 

  23. Τ. G. Langdon, Metals Forum 1, 59 (1978).

    CAS  Google Scholar 

  24. O. D. Sherby, R. H. Klundt, and A. K. Miller, Metall. Trans. 8A, 843 (1977).

    Article  Google Scholar 

  25. V. Raman and R. Berriche, Thin Films: Stresses and Mechanical Properties II, edited by M. F. Doerner, W. C. Oliver, G. M. Pharr, and F. R. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 171.

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Authors and Affiliations

  1. IBM Storage Systems Products Division, San Jose, California, 95193, USA

    V. Raman

  2. Department of Geology and Geophysics, University of Minnesota, Minneapolis, Minnesota, 55455, USA

    R. Berriche

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  1. V. Raman
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  2. R. Berriche
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Raman, V., Berriche, R. An investigation of the creep processes in tin and aluminum using a depth-sensing indentation technique. Journal of Materials Research 7, 627–638 (1992). https://doi.org/10.1557/JMR.1992.0627

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  • DOI: https://doi.org/10.1557/JMR.1992.0627

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