Abstract
The recently reported hysteretic behavior of silicon under indentation (Clarke et al.1 and Pharret al.2-5) is investigated using an ultra-micro-indentation system with an 8.5 μm spherical-tipped indenter. The onset of “plastic” behavior during loading and hysteresis during unloading was readily observed at loads in excess of 70 mN. Cracking about the residual impression was observed only at loads of 350 mN and higher. An analysis of the data is presented that estimates the following: (1) the initial onset of deformation occurs at a mean pressure of 11.8 ± 0.6 GPa, (2) the mean pressure at higher loads is 11.3 ± 1.3 GPa, and (3) the hysteretic transition on unloading occurs at mean pressures between 7.5 and 9.1 GPa. These values are in good agreement with the accepted literature values for the known silicon transformation pressures. A simulation of the force-displacement data based on the analysis and model is presented and is found to fit the observations very well.
Similar content being viewed by others
References
D.R. Clarke, M.C. Kroll, P.D. Kirchner, R.F. Cook, and B.J. Hockey, Phys. Rev. Lett. 21, 2156 (1988).
G. M. Pharr, W. C. Oliver, and D. R. Clarke, Scripta Metall. 23, 1949–1952 (1989).
G. M. Pharr, W. C. Oliver, and D. R. Clarke, J. Elec. Mater. 19, 881–887 (1990).
G. M. Pharr, W. C. Oliver, and D. S. Harding, J. Mater. Res. 6, 1129–1130 (1991).
G. M. Pharr, in Thin Films: Stresses and Mechanical Properties III, edited by W. D. Nix, J. C. Bravman, E. Arzt, and L. B. Freund (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992), pp. 301–312.
T. F. Page, W. C. Oliver, and C. J. McHargue, J. Mater. Res. 7, 450–473 (1992).
J.Z. Hu and I.L. Spain, Solid State Commun. 51, 263–266 (1984).
J.Z. Hu, L.D. Merkle, C.S. Menoni, and I.L. Spain, Phys. Rev. B 34, 4679–4684 (1986).
N.A. Goryunova, A.S. Borshcherskii, and D.N. Tretiakov, Physics of III–IV Compounds, Semi-conductors and Semi-metals (Academic Press, San Diego, CA, 1968), Vol 4, Chap. 1.
I.V. Gridneva, Yu. V. Milman, and V.I. Trefilov, Phys. Status Solidi (a) 14, 177 (1972).
J.J. Gilman, J. Mater. Res. 7, 535–538 (1992).
T. J. Bell, J. S. Field, and M. V. Swain, in Thin Films: Stresses and Mechanical Properties III, edited by W. D. Nix, J. C. Bravman, E. Arzt, and L. B. Freund (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992), pp. 331–336.
J.S. Field and M. V. Swain, J. Mater. Res. 8, 297–306 (1992).
H. Hertz, Hertz’s Miscellaneous Papers, Chaps. 5 and 6 (Macmillan, London, 1896).
K. L. Johnson, Contact Mechanics (Cambridge University Press, Cambridge, 1985).
H.A. Francis, Trans. ASME Series H 98, 272–280 (1976).
I.N. Sneddon, Proc. Cambridge Philos. Soc. 44, 429 (1948).
B.R. Lawn and T.R. Wilshaw, J. Mater. Sci. 10, 1049–1081 (1975).
A. E. H. Love, A Treatise on the Mathematical Theory of Elasticity, 4th ed. (Cambridge University Press, Cambridge, 1952).
M. J. Puttock and E. G. Thwaite, “Elastic Compression of Spheres and Cylinders at Point and Line Contact,” CSIRO Australia, National Measurement Laboratory, Technical Paper No. 25 (1969).
T.J. Bell, A. Bendeli, J. S. Field, M. V. Swain, and E. G. Thwaite, Metrologia 28, 463–469 (1991/92).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Weppelmann, E.R., Field, J.S. & Swain, M.V. Observation, analysis, and simulation of the hysteresis of silicon using ultra-micro-indentation with spherical indenters. Journal of Materials Research 8, 830–840 (1993). https://doi.org/10.1557/JMR.1993.0830
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.1993.0830