Abstract
The textures of thin copper films were determined quantitatively by measuring (111) pole figures with x-ray diffraction. Measurements were performed on a variety of samples, differing in copper film thickness and deposition technique, diffusion barrier material, and the presence or absence of a cap layer. Texture changes due to an annealing treatment were also recorded and correlated with stress measurements by the wafer-curvature technique. It is found that the deposition method (PVD vs CVD) has a strong effect on texture, barrier layer effects range from negligible to significant depending on the barrier material, and the effect of a cap layer is insignificant.
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Kuschke, W.M., Kretschmann, A., Keller, R.M. et al. Textures of thin copper films. Journal of Materials Research 13, 2962–2968 (1998). https://doi.org/10.1557/JMR.1998.0405
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DOI: https://doi.org/10.1557/JMR.1998.0405