Skip to main content
SpringerLink
Log in

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

  • Articles
  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

The tensile fracture behavior for solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps was examined. The annealing temperatures were in the range of 125–170 °C for 500 h. Prior to solid state annealing, the eutectic Sn–37Pb (SnPb) and Sn–0.7Cu (SnCu) solders showed fracture through the bulk solder. Brittle interfacial fracture occurred in the Sn–3.5Ag (SnAg) solder. After solid-state annealing, the fracture behavior changed dramatically. For eutectic SnPb solder, the fracture modes gradually changed from cohesive solder failure to interfacial fracture with increasing annealing temperature. The fracture mode of the SnCu solder showed greater change than the SnPb and SnCu solders. After annealing at 125 °C, the SnAg solder had a ductile taffy pull fracture, but an increase in temperature resulted in brittle interfacial fracture again. The SnCu solder maintained the same ductile taffy pull mode up to170 °C annealing, independent of the under bump metallization (UBM) type. Microstructure analysis showed that the interfacial fracture of the SnPb and SnAg solder bumps was ascribed to Pb-rich layer formation and Ag embrittlement at the interface, respectively. The bulk solder fracture of SnAg annealed at 125 °C appeared to be a transient phenomenon due to the abrupt breakdown of the hard lamella structure. The eutectic SnCu solder bumps had no significant change in the interfacial structure, except for interfacial intermetallic growth.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. International Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 2001).

  2. C.S. Chang, A. Oscilowski, and R. C. Bracken: Future challenges in electronics packaging. IEEE Circuits Device Mag. 14, 45 (1998).

    Article  Google Scholar 

  3. J. Cannis: Green IC packaging. Adv. Packaging 10, 38 (2001).

    Google Scholar 

  4. M. Abtew and G. Selvaduray: Lead-free solders in microelectronics. Mater Sci Eng R 27, 95 (2000).

    Google Scholar 

  5. G.J. Jackson, R. Durairaj, and N.N. Ekere: Characterisation of lead-free solder pastes for low cost flip-chip bumping, in Proc. 27th Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 2002 (IEEE, Piscataway, NY), pp. 223–228.

    Chapter  Google Scholar 

  6. J.W. Jang, A.P. De Silva, T.Y. Lee, J.K. Lin, and D.R. Frear: Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology. Appl Phys. Lett 79, 482 (2001).

    Article  CAS  Google Scholar 

  7. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang: Pb-free solders for flip-chip interconnects. JOM 53, 28 (2001).

    Article  CAS  Google Scholar 

  8. M. McCormack, S. Jin, and G.W. Kammlott: Suppression of mi-crostructural coarsening and creep deformation in a lead-free solder. Appl. Phys. Lett. 64, 580 (1994).

    Article  CAS  Google Scholar 

  9. J.S. Hwang, Z. Guo, and H. Koenigsmann: High-strength and high-fatigue-resistant lead-free solder. Surface Mount Technology 14, 55 (2000).

    Google Scholar 

  10. J.S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing, (McGraw Hill, New York, 1996), Chap. 3.

  11. W. Yang and R.W. Messler, Jr.: Microstructure evolution of eutectic Sn-Ag solder joints. J. Electron. Mater. 23, 765 (1994).

    Article  CAS  Google Scholar 

  12. V.M. López Hirata and K. Hirano: Ostwald ripening of -Fe precipitates in a Cu-1.5 at.% Fe alloy. Scripta Metall. 31, 117 (1994).

    Article  Google Scholar 

  13. D.M. Kim and A.J. Ardell: Coarsening of Ni3Ge in binary Ni–Ge alloys: Microstructures and volume fraction dependence of kinetics. Acta Mater. 51, 4073 (2003).

    Article  CAS  Google Scholar 

  14. T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K Zeng, and J.K. Kivilahti: Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002).

    Article  CAS  Google Scholar 

  15. J.S. Ha, T.S. Oh, and K.N. Tu: Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn-Cu solder and thin film metallization. J. Mater. Res. 18, 2109 (2003).

    Article  CAS  Google Scholar 

  16. P.G Kim, J.W. Jang, T.Y. Lee, and K.N. Tu: Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils. J. Appl. Phys. 86, 6746 (1999).

    Article  CAS  Google Scholar 

  17. T.B. Massalski: Binary Alloy Phase Diagrams (ASM International, Materials Park, OH, 1990), Vol. 3.

    Google Scholar 

  18. J.K. Lin, A. De Silva, D. Frear, Y. Guo, J.W. Jang, L. Li, D. Mitchell, B. Yeung, and C. Zhang: Characterization of lead-free solders and under bump metallurgies for flip-chip package, in Proc. 51st Electronic Components and Technology Conference, Orlando, FL, May 2001 (IEEE, Piscataway, NY), p. 455.

  19. Y. Guo, J.K. Lin, and A. De Silva: Reliability evaluations of chip interconnect in lead-free solder systems, in Proc. 52ndElectronic Components and Technology Conference 2002, San Diego, CA, May 2002 (IEEE, Piscataway, NY), p. 1275.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Freescale Semiconductor Corporation, Arizona, 2100 East Elliot Road, 85284, Tempe, USA

    Jin-Wook Jang, Ananda P. De Silva, Jong-Kai Lin & Darrel R. Frear

Authors
  1. Jin-Wook Jang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Ananda P. De Silva
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jong-Kai Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Darrel R. Frear
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jin-Wook Jang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Jang, JW., De Silva, A.P., Lin, JK. et al. Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps. Journal of Materials Research 19, 1826–1834 (2004). https://doi.org/10.1557/JMR.2004.0235

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/JMR.2004.0235

Search

Navigation