Abstract
Nanocrystalline (NC) metals are known for having excellent strength but perceived to have poor ductility. Miniature tensile tests on NC Ni-Fe measured ultimate strengths of 2 GPa and elongations, by digital image correlation, of up to 10%. Detailed examination of the fracture surface revealed dimpled rupture and cross-section reduction up to 75%, suggesting an intrinsic ability for small grained Ni-Fe to accommodate plasticity. A survey of published studies on NC metals reveals that this behavior is quite common; despite low macroscopic elongation, NC metals often achieve extensive deformation suggesting good intrinsic ductility. Unfortunately, the common sheet-like configuration of NC tensile specimens muddies a simple evaluation of ductility based on elongation, since thin and wide geometries promote localized necking that expedites catastrophic failure. This paper presents a compact review of ductility concepts and literature to interpret the experimental ductility measurements of an electrodeposited nickel alloy.
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References
E.O. Hall: The deformation and ageing of mild steel. 3. Discussion of results. Proc. Phys. Soc. London, Sect. B 64 (381), 747 (1951).
N.J. Petch: The cleavage strength of polycrystals. J. Iron. Steel Res. Int. 174 (1), 25 (1953).
M.A. Meyers, A. Mishra, and D.J. Benson: Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51 (4), 427 (2006).
K. Jonnalagadda, I. Chasiotis, S. Yagnamurthy, J. Lambros, J. Pulskamp, R. Polcawich, and M. Dubey: Experimental investigation of strain rate dependence of nanocrystalline Pt films. Exp. Mech. 50 (1), 25 (2010).
K. Jonnalagadda, N. Karanjgaokar, I. Chasiotis, J. Chee, and D. Peroulis: Strain rate sensitivity of nanocrystalline Au films at room temperature. Acta Mater. 58 (14), 4674 (2010).
P.G. Sanders, J.A. Eastman, and J.R. Weertman: Elastic and tensile behavior of nanocrystalline copper and palladium. Acta Mater. 45 (10), 4019 (1997).
G.W. Nieman, J.R. Weertman, and R.W. Siegel: Mechanical behavior of nanocrystalline Cu and Pd. J. Mater. Res. 6 (5), 1012 (1991).
N. Tsuji, Y. Ito, Y. Saito, and Y. Minamino: Strength and ductility of ultrafine grained aluminum and iron produced by arb and annealing. Scr. Mater. 47 (12), 893 (2002).
K.M. Youssef, R.O. Scattergood, K.L. Murty, J.A. Horton, and C.C. Koch: Ultrahigh strength and high ductility of bulk nanocrystalline copper. Appl. Phys. Lett. 87 (9), 091904-1-091904-3 (2005).
Y.F. Shen, L. Lu, Q.H. Lu, Z.H. Jin, and K. Lu: Tensile properties of copper with nano-scale twins. Scr. Mater. 52 (10), 989 (2005).
Y.M. Wang, A.V. Hamza, and E. Ma: Temperature-dependent strain rate sensitivity and activation volume of nanocrystalline Ni. Acta Mater. 54 (10), 2715 (2006).
M. Legros, B.R. Elliott, M.N. Rittner, J.R. Weertman, and K.J. Hemker: Microsample tensile testing of nanocrystalline metals. Philos. Mag. A 80 (4), 1017 (2000).
T.E. Buchheit, S.H. Goods, P.G. Kotula, and P.F. Hlava: Electrodeposited 80ni-20fe (permalloy) as a structural material for high aspect ratio microfabrication. Mater. Sci. Eng., A 432 (1-2), 149 (2006).
C. Gu, J. Lian, Z. Jiang, and Q. Jiang: Enhanced tensile ductility in an electrodeposited nanocrystalline Ni. Scr. Mater. 54 (4), 579 (2006).
R. Schwaiger, B. Moser, M. Dao, N. Chollacoop, and S. Suresh: Some critical experiments on the strain-rate sensitivity of nanocrystalline nickel. Acta Mater. 51 (17), 5159 (2003).
H. Li and F. Ebrahimi: Tensile behavior of a nanocrystalline ni-fe alloy. Acta Mater. 54 (10), 2877 (2006).
N. Wang, Z.R. Wang, K.T. Aust, and U. Erb: Room temperature creep behavior of nanocrystalline nickel produced by an electrodeposition technique. Mater. Sci. Eng., A 237 (2), 150 (1997).
F. Dalla Torre, P. Spatig, R. Schaublin, and M. Victoria: Deformation behaviour and microstructure of nanocrystalline electrodeposited and high pressure torsioned nickel. Acta Mater. 53 (8), 2337 (2005).
F. Dalla Torre, H. Van Swygenhoven, and M. Victoria: Nanocrystalline electrodeposited Ni: Microstructure and tensile properties. Acta Mater. 50 (15), 3957 (2002).
I. Brooks, G. Palumbo, G.D. Hibbard, Z. Wang, and U. Erb: On the intrinsic ductility of electrodeposited nanocrystalline metals. J. Mater. Sci. 46 (24), 7713 (2011).
H. Zhang, Z. Jiang, H. Lian, and Q. Jiang: Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size. Mater. Sci. Eng., A 479 (1-2), 136 (2008).
D.S. Gianola, S. Van Petegem, M. Legros, S. Brandstetter, H. Van Swygenhoven, and K.J. Hemker: Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin films. Acta Mater. 54 (8), 2253 (2006).
G.J. Fan, L.F. Fu, D.C. Qiao, H. Choo, P.K. Liaw, and N.D. Browning: Grain growth in a bulk nanocrystalline Co alloy during tensile plastic deformation. Scr. Mater. 54 (12), 2137 (2006).
J.A. Sharon, P.C. Su, F.B. Prinz, and K.J. Hemker: Stress-driven grain growth in nanocrystalline Pt thin films. Scr. Mater. 64 (1), 25 (2011).
Y.M. Wang, E. Ma, and M.W. Chen: Enhanced tensile ductility and toughness in nanostructured Cu. Appl. Phys. Lett. 80 (13), 2395 (2002).
N. Krasilnikov, W. Lojkowski, Z. Pakiela, and R. Valiev: Tensile strength and ductility of ultra-fine-grained nickel processed by severe plastic deformation. Mater. Sci. Eng., A 397 (1-2), 330 (2005).
V.L. Tellkamp, A. Melmed, and E.J. Lavernia: Mechanical behavior and microstructure of a thermally stable bulk nanostructured Al alloy. Metall. Mater. Trans. A 32 (9), 2335 (2001).
L. Lu, Y.F. Shen, X.H. Chen, L.H. Qian, and K. Lu: Ultrahigh strength and high electrical conductivity in copper. Science 304 (5669), 422 (2004).
X.J. Wu, L.G. Du, H.F. Zhang, J.F. Liu, Y.S. Zhou, Z.Q. Li, L.Y. Xiong, and Y.L. Bai: Synthesis and tensile property of nanocrystalline metal copper. Nanostruct. Mater. 12 (1-4), 221 (1999).
H. Conrad and D. Yang: Effect of an electric field on the plastic deformation kinetics of electrodeposited Cu at low and intermediate temperatures. Acta Mater. 50 (11), 2851 (2002).
A.A. Karimpoor, U. Erb, K.T. Aust, and G. Palumbo: High strength nanocrystalline cobalt with high tensile ductility. Scr. Mater. 49 (7), 651 (2003).
R.K. Guduru, K.L. Murty, K.M. Youssef, R.O. Scattergood, and C.C. Koch: Mechanical behavior of nanocrystalline copper. Mater. Sci. Eng., A 463 (1-2), 14 (2007).
S. Cheng, E. Ma, Y.M. Wang, L.J. Kecskes, K.M. Youssef, C.C. Koch, U.P. Trociewitz, and K. Han: Tensile properties of in situ consolidated nanocrystalline Cu. Acta Mater. 53 (5), 1521 (2005).
R.Z. Valiev, I.V. Alexandrov, Y.T. Zhu, and T.C. Lowe: Paradox of strength and ductility in metals processed by severe plastic deformation. J. Mater. Res. 17 (1), 5 (2002).
Y.H. Zhao, Y.Z. Guo, Q. Wei, A.M. Dangelewiez, Y.T. Zhu, T.G. Langdon, Y.Z. Zhou, E.J. Lavernia, and C. Xu: Influence of specimen dimensions on the tensile behavior of ultrafine-grained Cu. Scr. Mater. 59 (6), 627 (2008).
V.V. Stolyarov, Y.T. Zhu, I.V. Alexandrov, T.C. Lowe, and R.Z. Valiev: Influence of ECAP routes on the microstructure and properties of pure Ti. Mater. Sci. Eng., A 299 (1-2), 59 (2001).
Y.M. Wang and E. Ma: Temperature and strain rate effects on the strength and ductility of nanostructured copper. Appl. Phys. Lett. 83 (15), 3165 (2003).
C.C. Koch: Optimization of strength and ductility in nanocrystalline and ultrafine grained metals. Scr. Mater. 49 (7), 657 (2003).
M. Dao, L. Lu, R.J. Asaro, J.T.M. De Hosson, and E. Ma: Toward a quantitative understanding of mechanical behavior of nanocrystalline metals. Acta Mater. 55 (12), 4041 (2007).
C.C. Koch: Ductility in nanostructured and ultra fine-grained materials: Recent evidence for optimism. J. Metastable Nanocryst. Mater. 18, 9–20 (2003).
C.C. Koch, D.G. Morris, K. Lu, and A. Inoue: Ductility of nanostructured materials. MRS Bull. 24 (2), 54 (1999).
C.C. Koch, K.M. Youssef, R.O. Scattergood, and K.L. Murty: Breakthroughs in optimization of mechanical properties of nanostructured metals and alloys. Adv. Eng. Mater. 7 (9), 787 (2005).
Y.M. Wang and E. Ma: Three strategies to achieve uniform tensile deformation in a nanostructured metal. Acta Mater. 52 (6), 1699 (2004).
E. Ma: Eight routes to improve the tensile ductility of bulk nanostructured metals and alloys. JOM 58 (4), 49 (2006).
D. Witkin, Z. Lee, R. Rodriguez, S. Nutt, and E. Lavernia: Al-mg alloy engineered with bimodal grain size for high strength and increased ductility. Scr. Mater. 49 (4), 297 (2003).
Y. Wang, M. Chen, F. Zhou, and E. Ma: High tensile ductility in a nanostructured metal. Nature 419 (6910), 912 (2002).
Y. Zhao, T. Topping, J.F. Bingert, J.J. Thornton, A.M. Dangelewicz, Y. Li, W. Liu, Y. Zhu, Y. Zhou, and E.J. Lavernia: High tensile ductility and strength in bulk nanostructured nickel. Adv. Mater. 20 (16), 3028 (2008).
G. He, J. Eckert, W. Loser, and L. Schultz: Novel Ti-base nanostructure-dendrite composite with enhanced plasticity. Nat. Mater. 2 (1), 33 (2003).
E. Ma: Nanocrystalline materials: Controlling plastic instability. Nat. Mater. 2 (1), 7 (2003).
H.A. Padilla II, B.L. Boyce, B.G. Clark, and J.R. Michael: Grain-size scaling transitions in the fatigue behavior of ultrafine and nanocrystalline Ni-Fe. Acta Mater. (submitted).
J. Mayer, L.A. Giannuzzi, T. Kamino, and J. Michael: Tem sample preparation and Fib-induced damage. MRS Bull. 32 (5), 400 (2007).
F. Ebrahimi, Z. Ahmed, and H.Q. Li: Tensile properties of electrodeposited nanocrystalline Fcc metals. Mater. Manuf. Processes 21 (7), 687 (2006).
H. Li, F. Ebrahimi, H. Choo, and P.K. Liaw: Grain size dependence of tensile behavior in nanocrystalline ni-fe alloys. J. Mater. Sci. 41 (22), 7636 (2006).
H. Li, H. Choo, and P.K. Liaw: The effect of temperature on strain rate sensitivity in a nanocrystalline Ni-Fe alloy. J. Appl.Phys. 101 (6), 063536-1-063536-7 (2007).
Q. Wei: Strain rate effects in the ultrafine grain and nanocrystalline regimes—influence on some constitutive responses. J. Mater. Sci. 42 (5), 1709 (2007).
X.Y. Qin, X.G. Zhu, S. Gao, L.F. Chi, and J.S. Lee: Compression behaviour of bulk nanocrystalline ni-fe. J. Phys. Condens. Matter 14 (10), 2605 (2002).
W.A. Backofen: Deformation processing. Metall. Trans. 4 (12), 2679 (1973).
R. Hill: On discontinuous plastic states, with special reference to localized necking in thin sheets. J. Mech. Phys. Solids 1 (1), 19 (1952).
H.J. Lee, P. Zhang, and J.C. Bravman: Tensile failure by grain thinning in micromachined aluminum thin films. J. Appl. Phys. 93 (3), 1443 (2003).
Y.H. Zhao, Y.Z. Guo, Q. Wei, T.D. Topping, A.M. Dangelewicz, Y.T. Zhu, T.G. Langdon, and E.J. Lavernia: Influence of specimen dimensions and strain measurement methods on tensile stress-strain curves. Mater. Sci. Eng., A 525 (1-2), 68 (2009).
Y.M. Wang, S. Cheng, Q.M. Wei, E. Ma, T.G. Nieh, and A. Hamza: Effects of annealing and impurities on tensile properties of electrodeposited nanocrystalline Ni. Scr. Mater. 51 (11), 1023 (2004).
H.Q. Li and F. Ebrahimi: Transition of deformation and fracture behaviors in nanostructured face-centered-cubic metals. Appl. Phys. Lett. 84 (21), 4307 (2004).
H.Q. Li and F. Ebrahimi: Ductile-to-brittle transition in nanocrystalline metals. Adv. Mater. 17 (16), 1969 (2005).
C. Cheung, G. Palumbo, and U. Erb: Synthesis of nanocrystalline permalloy by electrodeposition. Scr. Metall. Mater. 31 (6), 735 (1994).
A. Hasnaoui, H. Van Swygenhoven, and P.M. Derlet: Dimples on nanocrystalline fracture surfaces as evidence for shear plane formation. Science 300 (5625), 1550 (2003).
T.L. Anderson: Fracture Mechanics: Fundamentals and Applications (Taylor & Francis, Boca Raton, FL, 2005).
Y. Yang, B. Imasogie, G.J. Fan, P.K. Liaw, and W.O. Soboyejo: Fatigue and fracture of a bulk nanocrystalline NiFe alloy. Metall. Mater.Trans. A 39 (5), 1145 (2008).
G. Taylor: Thermally-activated deformation of Bcc metals and alloys. Prog. Mater. Sci. 36, 29 (1992).
G. Schoeck: The activation energy of dislocation movement. Phys. Status Solidi B 8 (2), 499 (1965).
Y.M. Wang, A.V. Hamza, and E. Ma: Activation volume and density of mobile dislocations in plastically deforming nanocrystalline Ni. Appl. Phys. Lett. 86 (24), 241917-1-241917-3 (2005).
D.S. Gianola, D.H. Warner, J.F. Molinari, and K.J. Hemker: Increased strain rate sensitivity due to stress-coupled grain growth in nanocrystalline Al. Scr. Mater. 55 (7), 649 (2006).
H. Van Swygenhoven, P.M. Derlet, and A. Hasnaoui: Atomic mechanism for dislocation emission from nanosized grain boundaries. Phys. Rev. B: Condens. Matter 66 (2), 024101 (2002).
R.J. Asaro and S. Suresh: Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins. Acta Mater. 53 (12), 3369 (2005).
O.D. Sherby and J. Wadsworth: Superplasticity - recent advances and future-directions. Prog. Mater. Sci. 33 (3), 169 (1989).
H. Van Swygenhoven and P.M. Derlet: Grain-boundary sliding in nanocrystalline fcc metals. Phys. Rev. B: Condens. Matter 64 (22), 224105 (2001).
K.S. Kumar, S. Suresh, M.F. Chisholm, J.A. Horton, and P. Wang: Deformation of electrodeposited nanocrystalline nickel. Acta Mater. 51 (2), 387 (2003).
R.L. Coble: A model for boundary diffusion controlled creep in polycrystalline materials. J. Appl. Phys. 34 (6), 1679 (1963).
A.H. Chokshi, A. Rosen, J. Karch, and H. Gleiter: On the validity of the Hall-Petch relationship in nanocrystalline materials. Scr. Metall. 23 (10), 1679 (1989).
R.A. Masumura, P.M. Hazzledine, and C.S. Pande: Yield stress of fine grained materials. Acta Mater. 46 (13), 4527 (1998).
P.G. Sanders, M. Rittner, E. Kiedaisch, J.R. Weertman, H. Kung, and Y.C. Lu: Creep of nanocrystalline Cu, Pd, and al-Zr. Nanostruct. Mater. 9 (1-8), 433 (1997).
B. Cai, Q.P. Kong, L. Lu, and K. Lu: Interface controlled diffusional creep of nanocrystalline pure copper. Scr. Mater. 41 (7), 755 (1999).
L. Lu, M.L. Sui, and K. Lu: Superplastic extensibility of nanocrystalline copper at room temperature. Science 287 (5457), 1463 (2000).
A. Considère: Mémoire sur l’emploi du fer et de l’acier dons les constructions. Annales des Ponts et Chaussées. 9, 574 (1885).
E.W. Hart: Theory of the tensile test. Acta Metall. 15 (2), 351 (1967).
J.J. Jonas, R.A. Holt, and C.E. Coleman: Plastic stability in tension and compression. Acta Metall. 24 (10), 911 (1976).
U.F. Kocks, J.J. Jonas, and H. Mecking: The development of strain-rate gradients. Acta Metall. 27 (3), 419 (1979).
A.K. Ghosh: Tensile instability and necking in materials with strain hardening and strain-rate hardening. Acta Metall. 25 (12), 1413 (1977).
J.W. Hutchinson and K.W. Neale: Influence of strain-rate sensitivity on necking under uniaxial tension.Acta Metallurgica. 25 (8), 839 (1977).
I.H. Lin, J.P. Hirth, and E.W. Hart: Plastic instability in uniaxial tension tests. Acta Metall. 29 (5), 819 (1981).
T. Pardoen, M. Coulombier, A. Boe, A. Safi, C. Brugger, S. Ryelandt, P. Carbonnelle, S. Gravier, and J.P. Raskin: Ductility of thin metallic films. Mater. Sci. Forum 633-634 (2010).
F. Ebrahimi, G.R. Bourne, M.S. Kelly, and T.E. Matthews: Mechanical properties of nanocrystalline nickel produced by electrodeposition. Nanostruct. Mater. 11 (3), 343 (1999).
V. Tvergaard: Necking in tensile bars with rectangular cross-section. Comput. Meth. Appl. Mech. Eng. 103 (1-2), 273 (1993).
ASTM E8/E8M - 11: Standard Test Methods for Tension Testing of Metallic Materials, 27 (ASTM International, West Conshohocken, PA, (2011).
M.J. Barba: Resistance des Matériaux. Épreuves de résistance a la traction. Etude sur les allongements des métaux après rupture. Mem. Soc. Ing. Civils. 1, 682 (1880).
W.C. Unwin: Tensile tests of mild steel; and the relation of elongation to the size of the test-bar. Proc. Inst. Civ. Eng. Civ. Eng. 170, 233 (1903).
E.B. Kula and N.H. Fahey: Effect of specimen geometry on determination of elongation in sheet tension specimens. Mater. Res. Stand. 1, 631 (1961).
K.M. Youssef, R.O. Scattergood, K.L. Murty, and C.C. Koch: Ultratough nanocrystalline copper with a narrow grain size distribution. Appl. Phys. Lett. 85 (6), 929 (2004).
D.S. Gianola, B.G. Mendis, X.M. Cheng, and K.J. Hemker: Grain-size stabilization by impurities and effect on stress-coupled grain growth in nanocrystalline Al thin films. Mater. Sci. Eng., A 483-484, 637 (2008).
Acknowledgments
The authors would like to thank M. Rye for TEM specimen prep, Dr. B.G. Clark for TEM imaging, and Dr. A.M. Rowen for electro-deposition. This work was funded by the U.S. Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering. Specimen preparation and electron microscopy characterization was performed, in part, at the Center for Integrated Nanotechnologies, an Office of Science User Facility operated for the U.S. Department of Energy (DOE) Office of Science by Los Alamos National Laboratory (Contract No. DE-AC52-06NA25396) and Sandia National Laboratories (Contract No. DE-AC04-94AL85000). Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy’s National Nuclear Security Administration under Contract No. DE-AC04-94AL85000.
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Sharon, J.A., Padilla II, H.A. & Boyce, B.L. Interpreting the ductility of nanocrystalline metals. Journal of Materials Research 28, 1539–1552 (2013). https://doi.org/10.1557/jmr.2013.139
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DOI: https://doi.org/10.1557/jmr.2013.139