Abstract
A new generation of substrate materials with low dielectric permittivity have been developed. These new ceramic-based nanocomposites consist of a quasi two-dimensional, multilayered structure realized by the intercalation of molecular species into the galleries of a host lattice. The materials have been characterized by x-ray diffraction, electronic and infrared spectroscopy. The relative permittivities vary between 2.5 and 4 at 1 MHz. The new hybrids can be processed at relatively low temperatures (below 350°C) and allow for step coverage of submicron structures.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
B. Schwartz, Bull. Am. Cer. Soc., 63, 577 (1984).
L.E. Cross and T.R. Gururaja, in Electronic Packaging Materials Science II, edited by K.A. Jackson, R.C. Pohanka, D.R. Uhlmann and D.R. Ulrich (Mater. Res. Soc. Proc. 72, Pittsburgh, PA 1986) pp. 53–65.
D.R. Cagnon, J.D. Capistran, F.E. Karasz and R.W. Lenz, ACS Polym. Prepr. , 25, 284 (1984).
T. Kwon and T.J. Pinnavaia, Chem. Mat., 1, 381 (1989).
T.J. Pinnavaia, Science, 220, 365 (1983).
V. Mehrotra and E.P. Giannelis, unpublished results.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Mehrotra, V., Kwon, T. & Giannelis, E.P. New Multilayered Materials with Low Dielectric Permittivity for VLSI Applications. MRS Online Proceedings Library 167, 181–186 (1989). https://doi.org/10.1557/PROC-167-181
Published:
Issue Date:
DOI: https://doi.org/10.1557/PROC-167-181