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Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation

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Abstract

Cross sections of material specimens for TEM analysis must be produced in the shortest time possible, contain few, if any, artifacts and have a large area available for analysis. The analyst must also be able to prepare these cross sections from specified areas of complex, heterogeneous structures on a routine, reproducible basis to meet the growing needs of the semiconductor industry for TEM analysis. The specimen preparation spatial resolution required for preparing precision cross sections is substantially less than one micron. Cross sections meeting these requirements can be prepared by mounting a specimen to the Tripod Polisher and mechanically polishing on one side of the specimen, using a sequence of progressively finer grit diamond lapping films, until the area of interest is reached. This polished surface is then very briefly polished on a cloth wheel with colloidal silica to attain the final polish on that side. The specimen is then flipped over on the Tripod Polisher and polished from the other side, using same sequence of diamond lapping films to reach the predefined area of interest. The Tripod Polisher is set at a slight angle, to produce a tapered, wedge-shaped specimen, which has the area of interest at the thinnest edge of the taper. The specimen is polished with the diamond lapping films and the colloidal silica until it is 1000 Angstroms or less in thickness. The specimen is removed from the polisher and mounted on a 2 x 1mm slotted grid with M-Bond 610 epoxy. After the epoxy is cured the specimen can be taken directly to the microscope for analysis. The need for ion milling has been eliminated or reduced to a few minutes in most of our work because of the thinness of the final specimen. The total specimen preparation time is between 2.5 and 4 hours, depending on the specimen and the size of the specified area. The area available for analysis ranges from 0.5mm up to the full size of the mounting grid opening. The wedge shape of the specimen provides the mechanical stability needed for a long thin specimen.

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References

  1. S. J. Klepeis, et al., in Specimen Preparation for Transmission Electron Microscopy of Materials, ed. Bravman, et al., Mater. Res. Soc. Proc. 115, Pittsburgh, PA USA p. 179.

  2. R. M. Anderson, et al., Microscopy of Semiconducting Materials 1989, Proceedings of the Physics Conference held at Oxford University, 10-13 April 1989, ed. by A. G. Cullis and J. L. Hutchison, Institute of Physics Conference Series Number 100, Bristol and New York, 1989.

  3. S. J. Klepeis, et al., EMSA Proceedings. ed. by G.W. Bailey, San Francisco Press, p. 712, 1989.

  4. J.P. Benedict, et al., in International Symposium on Electron Microscopy. ed. By K. Kuo and J. Yao, World Scientific, p. 450, 1990.

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Benedict, J., Anderson, R. & Klepeis, S.J. Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation. MRS Online Proceedings Library 254, 121–140 (1991). https://doi.org/10.1557/PROC-254-121

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  • DOI: https://doi.org/10.1557/PROC-254-121

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