Skip to main content
SpringerLink
Log in

Failure in Tungsten-Filled Via Structures

  • Published:
MRS Online Proceedings Library Aims and scope

Abstract

Failure of the tungsten-filled via interconnect structure is modelled. Two mechanisms contributing to void growth are considered: relief of stress due to differential thermal expansion, and electromigration. A self-limiting void volume is predicted, resulting in a self-limiting resistance increase which is a function of structure geometry and the void morphology. The relative contributions of the two mechanisms change significantly as the temperature and current density are reduced from accelerated test conditions, affecting the extrapolation of test results to service conditions. Modified procedures for extrapolating lifetimes are discussed, as well as suggested process changes to improve reliability.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. I. A. Blech and C. Herring, Appl. Phys. Lett. 29, 131 (1976).

    Article  CAS  Google Scholar 

  2. M. A. Korhonen, P. Børgesen, K. N. Tu, and C.-Y. Li, J. Appl. Phys. 73, 3790 (1993).

    Article  CAS  Google Scholar 

  3. P. Børgesen, M. A. Korhonen, D. D. Brown, C.-Y. Li, H. S. Rathore, and P. A. Totta in Stress-Induced Phenomena in Metallization, edited by P. S. Ho, C.-Y. Li and P. Totta (American Institute of Physics Conference Proceddings No. 305, New York, 1994), p. 231.

    Google Scholar 

  4. J. E. Sanchez, Jr. and V. Pham, MRS Symposium Proceedings 338, 459 (1994).

  5. P. B. Ghate, Proc. 23rd Annual International Reliability Physics Symposium (IEEE, New York, 1982), p. 292.

    Book  Google Scholar 

  6. R. G. Filippi, G. A. Biery, and M. H. Wood, MRS Symposium Proceedings 309, 141 (1993).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Digital Equipment Corp., MA, 77 Reed Road, 01749, Hudson, USA

    J. J. Clement & J. R. Lloyd

  2. ##, Massachusetts Institute of Technology, MA, 02139, Cambridge, USA

    C. V. Thompson

Authors
  1. J. J. Clement
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. J. R. Lloyd
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. C. V. Thompson
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Clement, J.J., Lloyd, J.R. & Thompson, C.V. Failure in Tungsten-Filled Via Structures. MRS Online Proceedings Library 391, 423 (1995). https://doi.org/10.1557/PROC-391-423

Download citation

  • Published:

  • DOI: https://doi.org/10.1557/PROC-391-423

Search

Navigation