Abstract
Ultrathin (tox, eq < 2.0 nm) Si3N4/SiO2(hereafter N/O) gate dielectrics with improved interface characteristics compared to devices with thermal oxides have been formed by remote plasma enhanced CVD of Si3N4onto oxides. If the Si-Si02 interface is intentionally nitrided prior to the Si3N4deposition, the increased physical thickness of the N/O stack combined with the interfacial nitridation reduces the direct tunneling current by more than two orders of magnitude. The ensuing device structure can then be characterized as N/O/N. The top nitride layer is also an effective boron diffusion barrier improving short channel characteristics in p+-poly PMOSFETs. In addition, nitrogen can also be transported to the silicon/dielectric interface during post-deposition RTAs, and this reduces degradation of transconductance during hot carrier stressing.
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References
G. Hu and R. Bruce, IEEE Trans. Elec. Dev. ED-32, 584 (1985).
S. Wolf, Silicon procession for the VLSI Era, Vol. 3, Lattice Press, Sunset Beach, CA, p. 311, (1995).
J. Pfiester and F. Baker, IEEE Elec. Dev. Lett. 11, 247 (1990).
T. Mogami, L. Johansson, I. Sakai, and M. Fukuma, IEDM Tech. Dig. 533 (1991).
E. Vogel, P. McLarty, and J. Wortman, IEEE Tran. Elec. Dev. ED- 43, 753 (1996).
Y. Wu and G. Lucovsky, IEEE International Reliability Physics Symposium 70, (1998).
S. Lo, D. Buchanan, Y. Taur, and W. Wang, IEEE Elec. Dev. Lett. 18, 209 (1997).
G. Alers, D. Werder, and Y. Chabal, Appl. Phys. Lett 73, 1517 (1998).
K. Hubbard and D. Schlom, J. Mater. Res. 11, 2757 (1996).
C. Parker, G. Lucovsky, and J. Hauser, IEEE Elec. Dev. Lett. 19, 106 (1998).
Y. Ma, T. Yasuda, and G. Lucovsky, Appl. Phys. Lett. 64, 2226 (1994).
S.V Hattangady, H. Niimi and G. Lucovsky, J. Vac. Sci. Technol. A 14, 3017 (1996).
S.V. Hattangady, H. Niimi, and G. Lucovsky, Appl. Phys. Lett. 66, 3495 (1995).
Y. Wu and G. Lucovsky, IEEE Elec. Dev. Lett 19, 367 (1998).
J. Hauser, IEEE TED, 44, 1009 (1997)
M. L. Green et al., Appl. Phys. Lett. 65, 848, (1994).
D. Wristers, L. Han, and D. Kwong, Appl. Phys. Lett. 68, 2094 (1996).
G. Lucovsky et al., Appl. Phys. Lett. 74 (April 5, 1999).
H. Yang, H. Niimi, Y. Wu and G. Lucovsky, submitted to IEEE Elec. Dev. Lett. (1999).
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Wu, Y., Lucovsky, G. Aggressively Scaled P-Channel Mosfets With Stacked Nitride-Oxide-Nitride, N/O/N, Gate Dielectrics. MRS Online Proceedings Library 567, 101–106 (1999). https://doi.org/10.1557/PROC-567-101
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DOI: https://doi.org/10.1557/PROC-567-101