Abstract
Silane activation, predominantly in the gas phase, has been observed during the chemical vapor deposition of Ti-Si-N thin films using Ti(NMe2)4, tetrakis(dimethylamido)titanium, silane, and ammonia at 450°C, using molecular beam mass spectrometry. The extent of silane reactivity was dependent upon the relative amounts of Ti(NMe2)4and NH3. Additionally, each TDMAT molecule activates multiple silane molecules. Ti-Si-N thin films were deposited using similar process conditions as the molecular beam experiments, and RBS and XPS were used to determine their atomic composition. The variations of the Ti:Si ratio in the films as a function of Ti(NMe2)4 and NH3 flows were consistent with the changes in silane reactivity under similar conditions.
Similar content being viewed by others
References
P. M. Smith and J. S. Custer, Appl. Phys. Lett. 70, 3116 (1997).
J. S. Reid, Amorphous ternary diffusion barriers for silicon metallizations. Ph.D. Thesis, California Institute of Technology, May, 1995.
(a) X. Sun, J. S. Reid, E. Kolawa, and M. A. Nicolet, J. Appl. Phys. 81, 656 (1997).
X. Sun, J.S. Reid, E. Kolawa, and M.A. Nicolet, J. Appl. Phys. 81, 664 (1997).
I. J. Raaijmakers, Thin Solid Films 247, 85 (1994).
K. Sugiyama, P. Sangryul Pac, Y. Takahashi, and S. Motojima, J. Electrochem. Soc., 122, 1545 (1975).
(a) R. M. Fix, R. G. Gordon, and D. M. Hoffman, Chem. Mater. 2, 235 (1990).
R.M. Fix, R.G. Gordon, and D.M. Hoffman, Chem. Mater. 3, 1138 (1991).
J.M. Musher and R.G. Gordon, J. Mater. Res. 11, 989 (1996).
J.M. Musher and R.G. Gordon, J. Electrochem. Soc., 143, 736 (1996).
D.M. Hoffman, Polyhedron, 13, 1169 (1994).
(a) A. Katz, A. Feingold, S. J. Pearton, S. Nakahara, M. Ellington, U. K. Chakrabarti, M. Geva, and E. Lane, J. Appl. Phys. 70, 3666 (1991).
A. Katz, A. Feingold, S. Nakahara, S.J. Pearton, E. Lane, M. Geva, F.A. Stevie, and K. Jones, J. Appl. Phys. 15, 993 (1992).
S. C. Sun and M. H. Tsai, Thin Solid Films, 253, 440 (1994).
A. Paranjpe. and M. IslamRaja, J. Vac. Sci. Technol. B., 13, 2105 (1995).
C. M. Truong, P. J. Chen, J. S. Corneille, W. S. Oh, and D. W. Goodman, J. Phys. Chem. 99, 8831 (1995).
(a) L. H. Dubois, B. R. Zegarski, and G. S. Girolami, J. Electrochem. Soc. 139, 3603 (1992).
J.A. Prybyla, C.-M. Chiang, and L.H. Dubois, J. Electrochem. Soc. 140, 2695 (1993).
L.H. Dubois, Polyhedron 13, 1329 (1994).
(a) B. H. Weiler, Chem. Mater. 7, 1609 (1995). (b) B.H. Weiler, J. Am. Chem. Soc. 118, 4975 (1996).
H. O. Pierson, Handbook of Chemical Vapor Deposition: Principles, Technology and Applications, (Noyes Publications: Park Ridge, New Jersey, 1992).
(a) T. R. Cundari, J. Am. Chem. Soc. 114, 10557 (1992). (b) T.R. Cundari and M.S. Gordon, J. Am. Chem. Soc. 115, 4210 (1993). (c) T.R. Cundari, and J.M. Morse, Chem. Mater. 8, 189 (1996).
(a) C. H. Winter, P. H. Sheridan, T. S. Lewkebandara, M. J. Heeg, and J. W. Proscia, J. Am. Chem. Soc., 114, 1095 (1992). (b) T.S. Lewkebandara, P.H. Sheridan, M.J. Heeg, A.L. Rheingold, and C.H. Winter, Inorg. Chem. 33, 5879 (1994).
J. E. Hill, R. D. Profilet, P. E. Fanwick, I. P. Rothwell, Angew. Chem. Int. Ed. Engl., 29, 664 (1990).
H. W. Roesky, H. Voelker, M. Witt, and M. Noltemeyer, Angew. Chem. Int. Ed. Engl., 29, 669 (1990).
C. C. Cummins, C. P. Schaller, Van G. D. Duyne, P. T. Wolczanski, A. W. E. Chan, and R. Hoffman, J. Am. Chem. Soc. 113, 2985 (1991).
W. A. Nugent, and B. L. Haymore, Coordination Chem. Rev. 31, 123 (1980).
W. A. Nugent, and R. L. Harlow, J.C.S. Chem. Comm., 579 (1978).
C. C. Cummins, S. M. Baxter, and P. T. Wolczanski J. Am. Chem. Soc. 110, 8731 (1988).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Amato-Wierda, C., Norton, E.T. & Wierda, D.A. Aspects of Gas Phase Chemistry During Chemical Vapor Deposition of Ti−Si−N Thin Films With Ti(NMe2)4 (TDMAT), NH3, and SiH4. MRS Online Proceedings Library 606, 97 (1999). https://doi.org/10.1557/PROC-606-97
Published:
DOI: https://doi.org/10.1557/PROC-606-97