Low Resistivity Boron Doped Amorphous Silicon-Germanium Alloy Films Obtained with a Low Frequency Plasma

Abstract

The structural and electrical properties of boron doped amorphous silicon-germanium alloy films, obtained using a low frequency plasma enhanced chemical vapor deposition (LF PECVD), are presented in this contribution. These thin films were deposited on a substrate heated at 270°C, and by decomposing a mixture of silane, germane, and diborane gases. The chemical bond structure was studied by Infrared Spectroscopy. Our results show that, for a constant diborane flow, the increase of germane flow enhances the incorporation of boron into the film; the peak at 2540 cm⁻¹ becomes larger as the Ge content increases. Transport of carriers was studied by measuring current-voltage curves as a function of temperature. The conductivity increased from 10⁻⁶ to 10 (Q-cm)⁻¹, while the refraction index increased from 3.312 to 4.4458, for an increasing Ge content; this makes the films suitable for optical waveguide applications. On the other hand, the activation energy varied from 0.668 to 0.220 eV when the sample was doped with boron. The AFM images showed that the surface roughness was improved for an alloy with 50% of Ge.