Title |
SNS Warm Linac Circulator Breakdown Considerations for the PPU Project |
Authors |
- G.D. Toby, Y.W. Kang, S.-H. Kim, S.W. Lee, J.S. Moss
ORNL, Oak Ridge, Tennessee, USA
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Abstract |
Multipacting in accelerating structures is a complex phenomenon about which there is much to be understood. While multipacting research efforts have primarily been focused on superconducting radio frequency (SRF) systems, normal conducting accelerating structures which have a higher thermal capacity, and a greater vacuum pressure tolerance could benefit from additional investigation. This research details multipacting simulation methods and the results of 3-D electromagnetic simulations of RF vacuum windows used on normal conducting linac (NCL) cavities. Benchmarking of the peak electric fields in these structures, benefits of material processing and possible techniques for reducing or eliminating multipacting activities are discussed.
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Funding |
* This material is based upon work supported by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences, under contract number DE-AC05-00OR22725. |
Paper |
download MOPAB335.PDF [0.610 MB / 3 pages] |
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Conference |
IPAC2021 |
Series |
International Particle Accelerator Conference (12th) |
Location |
Campinas, SP, Brazil |
Date |
24-28 May 2021 |
Publisher |
JACoW Publishing, Geneva, Switzerland |
Editorial Board |
Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany) |
Online ISBN |
978-3-95450-214-1 |
Online ISSN |
2673-5490 |
Received |
17 May 2021 |
Accepted |
28 May 2021 |
Issue Date |
23 August 2021 |
DOI |
doi:10.18429/JACoW-IPAC2021-MOPAB335 |
Pages |
1041-1043 |
Copyright |
Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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