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Thermal Science 2022 Volume 26, Issue 2 Part B, Pages: 1463-1475
https://doi.org/10.2298/TSCI201111196F
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Design and analysis of liquid cooling plates for different flow channel configurations

Farhan Muhammad (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Amjad Muhammad (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan), amjad9002@uet.edu.pk
Tahir Zia ul Rehman (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Anwar Zahid (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Arslan Muhammad (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Mujtaba Ahmad (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Riaz Fahid (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Imran Shahid (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Razzaq Luqman (Faculty of Mechanical Engineering, University of Engineering and Technology, Lahore, Pakistan)
Ali Mudassar (Faculty of Mechanical Engineering, University of Engineering & Technology Lahore, Pakistan)
Filho Enio P. Bandarra (School of Mechanical Engineering, Federal University of Uberlandia (UFU), Uberlandia, Brazil)
Du Xioze (School of Energy, Power and Mechanical Engineering, North China Electric Power University, Beijing, China)

A number of thermal management devices are used to actuate concentrated electronic appliances in an efficient way. A liquid cooling plate acts as a heat sink enclosed by materialized walls. This work aims to carry out design of liquid cooling plates such that the heat diffused by the electronic equipment is removed while their temperatures levels remain within safe limits. The liquid cooling plates expose “cold surfaces” to electronic appliances. The performance of a cooling plate is estimated depending upon heat carrying capacity, associated heat transfer rates and concentrated thermal regions on the plate surface. For this study, the design of liquid cooling plate was done with SOLIDWORKS. Pure water was used as a working fluid in test channels. A comparative analysis of flow distribution, temperature contours, pressure drop, and pumping power for different channel configurations was carried out with ANSYS. It was observed that a channel configuration is of key importance in liquid cooling plates. The findings from this study are beneficial for the optimum design of cooling systems for high heat flux applications, i.e., in electronic devices, computer processors and automotive engines.

Keywords: Liquid cooling plate, Channel configuration, Flow distribution, Heat transfer

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