Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Hiroyuki Ishida; Stefan Lutter

doi:10.2494/photopolymer.27.173

Journal of Photopolymer Science and Technology

Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Hiroyuki Ishida, Stefan Lutter

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Keywords: wafer bonding, temporary bonding, de-bonding, silicone, polyimide, MEMS, 3D stacking

JOURNAL FREE ACCESS

2014 Volume 27 Issue 2 Pages 173-176

DOI https://doi.org/10.2494/photopolymer.27.173

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Abstract

There can be two kinds of de-bonding options in the aspect of the releasing interface, one is carrier release and the other is device wafer release. Thermoplastic adhesives are used in most cases for carrier release because the materials can easily be cleaned by solvent. On the other hand, device wafer release is usually selected for thermoset adhesives, which is difficult to remove by solvent.

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