New Organic Photo-Curable Nanoimprint Resist ≪mr-NIL210≫ for High Volume Fabrication Applying Soft PDMS-Based Stamps

Martin Messerschmidt; Andrew Greer; Florian Schlachter; Julian Barnett; Manuel W. Thesen; Nikolaj Gadegaard; Gabi Grutzner; Arne Schleunitz

doi:10.2494/photopolymer.30.605

Martin Messerschmidt, Andrew Greer, Florian Schlachter, Julian Barnett, Manuel W. Thesen, Nikolaj Gadegaard, Gabi Grutzner, Arne Schleunitz

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Keywords: Nanoimprint lithography, PDMS-based stamps, High volume nanofabrication, PDMS compatibility

JOURNAL FREE ACCESS

2017 Volume 30 Issue 5 Pages 605-611

DOI https://doi.org/10.2494/photopolymer.30.605

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Abstract

Herein, we report on a newly developed and commercialized organic photo-curable Nanoimprint Lithography (NIL) resist, namely mr-NIL210. Since this new NIL resist follows an innovative design concept and contains solely specific monomers with a characteristic chemistry and molecular design, an extended longevity of applied polydimethyl siloxane (PDMS) stamps is enabled addressing a crucial key metric for industrial high-volume manufacturing processes. Moreover, the mr-NIL210 is characterized by a negligible oxygen sensitivity of the curing chemistry, outstanding film forming and adhesion performances as well as excellent plasma-based dry etch characteristics for various substrate materials like silicon, aluminum, sapphire, titanium, etc.

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