Abstract
References
Information
X J Fan and E Suhir, Moisture Sensitivity of Plastic Packages of IC Devices; 2, Springer. (2010)
10.1007/978-1-4419-5719-1L A Shalaby, K M El Sobki and A A Abdel Azim, Corros. Sci, 16; 637 (1976)
10.1016/0011-2275(76)90207-1K Kusaka, D Taniguchib, T Hanabusaa and K Tominagaa, Vacuum, 59; 806 (2000)
10.1016/s0042-207x(00)00351-1S-J Hwang, J-H Lee, C-O Jeong and Y-C Joo, Scripta Mater, 56; 17 (2007)
10.1016/s1359-6462(07)00239-4- Publisher :Materials Research Society of Korea
- Publisher(Ko) :한국재료학회
- Journal Title :Korean Journal of Materials Research
- Journal Title(Ko) :한국재료학회지
- Volume : 26
- No :8
- Pages :438-443
- Received Date : 2016-03-25
- Revised Date : 2016-07-08
- Accepted Date : 2016-07-08
- DOI :https://doi.org/10.3740/MRSK.2016.26.8.438