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Investigating the Effects of Temperature, Paste Height, and Time on Solder Paste to Its Printing Performance

Investigating the Effects of Temperature, Paste Height, and Time on Solder Paste to Its Printing Performance

Patrick Uche Okafor, James Eke, Ndidi Stella Arinze, Osondu Ignatius Onah
Copyright: © 2021 |Pages: 26
ISBN13: 9781799869924|ISBN10: 179986992X|ISBN13 Softcover: 9781799869931|EISBN13: 9781799869948
DOI: 10.4018/978-1-7998-6992-4.ch012
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MLA

Okafor, Patrick Uche, et al. "Investigating the Effects of Temperature, Paste Height, and Time on Solder Paste to Its Printing Performance." Handbook of Research on 5G Networks and Advancements in Computing, Electronics, and Electrical Engineering, edited by Augustine O. Nwajana and Isibor Kennedy Ihianle, IGI Global, 2021, pp. 300-325. https://doi.org/10.4018/978-1-7998-6992-4.ch012

APA

Okafor, P. U., Eke, J., Arinze, N. S., & Onah, O. I. (2021). Investigating the Effects of Temperature, Paste Height, and Time on Solder Paste to Its Printing Performance. In A. Nwajana & I. Ihianle (Eds.), Handbook of Research on 5G Networks and Advancements in Computing, Electronics, and Electrical Engineering (pp. 300-325). IGI Global. https://doi.org/10.4018/978-1-7998-6992-4.ch012

Chicago

Okafor, Patrick Uche, et al. "Investigating the Effects of Temperature, Paste Height, and Time on Solder Paste to Its Printing Performance." In Handbook of Research on 5G Networks and Advancements in Computing, Electronics, and Electrical Engineering, edited by Augustine O. Nwajana and Isibor Kennedy Ihianle, 300-325. Hershey, PA: IGI Global, 2021. https://doi.org/10.4018/978-1-7998-6992-4.ch012

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Abstract

Due to pressure to meet consumer requirements, miniaturization, reliability, and increased functionality have become more important. To achieve good assembly of electronic devices, there must be smooth deposition of tiny and consistent paste deposits on the board which must be up to an acceptable height and volume based on desirable process parameters in the output. The printing performance of the solder paste is dependent on conditions such as paste deformation behavior, good paste roll, complete aperture filling, and paste release onto the substrate pads. Eighteen tests were performed using two types of lead-free solder paste. Three temperatures were investigated under three different time intervals. Results analysis showed that variability of the paste distribution was lowest and more uniform for paste stored at 25˚C for 48 hours. From the analysis, it is obvious that temperature has tremendous effects on the printing performance of solder paste. This study recommends 25˚C as a good temperature for solder paste printing.

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