Paper Titles

A Wire Feed Control System Based on Detecting Induced Electromotive Force of the Motor
p.781

Investigation to Angular Resolution in Cube-Orientation-Based Interactions
p.785

A Study of Fibrin Zymography Method for the Assay of Plasminogen Activators
p.789

Research on the Safety of Rear Seat Occupants in the Frontal Collision
p.795

Traffic Impact Analysis of Road Construction Based on Vissim
p.800

Analysis of Logistics Center Location-Selecting Based on GIS - Take Li County as an Example
p.804

Design of Data Acquisition System Based on LabVIEW
p.808

The Study of Network Authentication Methods Based on Palmprint and Digital Watermarking
p.814

Unstable Manifold of Hénon Map
p.818

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 569Design of Data Acquisition System Based on LabVIEW

Design of Data Acquisition System Based on LabVIEW

Article Preview

Abstract:

Based on LabVIEW, this paper presents a design scheme of data acquisition, which it proposes using computer and ordinary data collection card as the main hardware and LabVIEW as software development platform, thus constructs the virtual instrument system for signal acquisition. The system can realize synchronous data acquisition of single channel or multi-channel signal, as well as real-time display and preservation. The practice shows that this scheme can not only effectively play performance of ordinary data acquisition card, but also reduce greatly program development time and beautify interface through LabVIEW which has powerfully visual human-machine interface editor and graphical programming function.

You might also be interested in these eBooks

Advanced Materials Design and Mechanics

Info:

Periodical:

Advanced Materials Research (Volume 569)

Pages:

808-813

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.569.808

Citation:

Cite this paper

Online since:

September 2012

Authors:

Ling Gang Liu, Jun Hui Li, Lu Hua Deng

Keywords:

Data Acquisition, DMA, LabVIEW, Virtual Instrument (VI)

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

[1] B. Zhang, L. Liu, G. Gao and P. Zhao: Data Acquisition and Signal Analysis Based on LabVIEW, Instrument Tech. and Sensor, in Chinese, No. 12 (2007), pp.74-75.

[2] Y. H. Tian, C. J. Hang, C. Q. Wang, G. Q. Ouyang, D. S. Yang and J. P. Zhao: Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound, Microelectron. Reliab., vol. 51, no. 1(2011), pp.157-165.

DOI: 10.1016/j.microrel.2010.06.004

[3] Y. Xu and J. Li: Development of Data Collection and Process System for Complex Surfaces Pressure with LabVIEW, Light Industry Machinery, in Chinese, Vol. 27, No. 4(2009), pp.79-82.

[4] J H Zhang, J Zhang and L Yang: Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging with Nonconductive Film, J. Electron. Packaging, vol. 132(2010), p.044501.

DOI: 10.1115/1.4002898

[5] Z. Zhao, S. Deng and Y. Tan: Data Collection and Analysis System Based on LabVIEW, Computer&Digital Engi., in Chinese, Vol. 38, No. 5(2010), pp.81-83.

[6] W. Li, R. Tian and L. Yi: The System of Data Acquisition and Signal Analysis Based on LabVIEW, Modern Electr, Tech., in Chinese, Vol. 28, No. 20(2005), pp.10-12.

[7] B. Xie, C. Chen and B. Zhen: Design of Data Acquisition and Signal Processing System Based on LabView, Modern Electr. Tech., in Chinese, Vol. 34, No. 14(2011), pp.173-175.

[8] J. Li, Liu L., L. Deng, B. Ma, F. Wang and L. Han: Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding, IEEE Electr. Device L, vol. 32, No. 10(2011), pp.1433-1435.

DOI: 10.1109/led.2011.2161749

[9] Y. Liu and X. Bu: Development of Data Acquisition and Wireless Communication System Based on LabVIEW, Measurement and Control Tech., in Chinese, Vol. 25, No. 2(2006), pp.22-24.

[10] H. Xu, C. Liu, V.V. Silberschmidt, S.S. Pramana, T.J. White, Z. Chen and V. L. Acoff: Behavior of intermetallics, aluminum oxide and voids in Cu-Al wire bonds, Acta Materialia, vol. 59, no. 14(2011), pp.5661-5673.

DOI: 10.1016/j.actamat.2011.05.041

[11] J. Li, L. Han, J. Duan, J. Zhong, Interface Mechanism of Ultrasonic Flip Chip Bonding, Appl. Phys. Lett., Vol. 90, (2007), p.242902.

DOI: 10.1063/1.2747673

[12] B. I. Noh, J. M. Koo, J. L. Jo, and S. B. Jung: Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding, JPN. J. Appl. Phys., vol. 47, no. 5(2008), pp.4257-4261.

DOI: 10.1143/jjap.47.4257

[13] S. Murali, N. Srikanth and C. J. Vath III: Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds, Mater. Lett., vol. 58, no. 25(2004), pp.3096-3101.

DOI: 10.1016/j.matlet.2004.05.070

[14] S. Lin and F. Yang: The Research of Multichannel DAQ System Based on LabVIEW, Shanxi Electr. Tech., in Chinese, No. 3(2009), pp.18-20.

[15] U. Geissler, J. Funck, M. Schneider-Ramelow, H. J. Engelmann, I. Rooch,W. H. Muller, and H. Reichl: Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts, J. Electron. Mater., vol. 40, no. 2(2011), pp.239-246.

DOI: 10.1007/s11664-010-1439-2

[16] J. Li, J. Duan, L. Han and J. Zhong: Microstructural characteristics of Au/Al bonded interfaces, Mater. Charact. Vol. 58(2007), pp.103-107.

DOI: 10.1016/j.matchar.2006.03.018

[17] H. Ji, M. Li, J. Kim, D. Kim and C. Wang: Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy, Mater. Charact., vol. 59(2008), pp.1419-1424.

DOI: 10.1016/j.matchar.2008.01.001

[18] H. Kim, J. Y. Lee, K. W. Paik and K. W. Koh: Effects of Cu/Al Intermetallic Compound (IMC) on Copper Wire and Aluminum Pad Bondability, IEEE T. Compon. Pack. T., vol. 26, no. 2(2003), pp.367-374.

DOI: 10.1109/tcapt.2003.815121

[19] L. Zou, X. Wang and L. Qian: Design and Implementation of 1 GHz High Speed Data Acquisition System, Sys. Engi. and Elec., Vol. 20, No. 1(2009), pp.55-59.

[20] X. Yue, Drakakis, Lim and Radomska: A Real-Time Multi-Channel Monitoring System for Stem Cell Culture Process, IEEE transact. on biomedical cir. and sys., Vol. 2, No. 2(2008), pp.66-77.

DOI: 10.1109/tbcas.2008.925639

[21] C.F.M. Loureiro, V.M.G. Martins, F.M.C. Clemencio and C.M.B.A. Correia: A fundamental data acquisition saving block, IEEE Nuclear Sci. Sym., Vol. 2(2005), pp.685-686.

DOI: 10.1109/nssmic.2005.1596351