Self-Healing Epoxy Composites – Part I: Curing Kinetics and Heat-Resistant Performance

Tao Yin; Min Zhi Rong; Ming Qiu Zhang

doi:10.4028/www.scientific.net/AMR.716.383

Paper Titles

Hollow Glass Microspheres Coated with La_0.6Sr_0.4MnO₃ and its Microwave Absorption Property
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Preparation of ZnO/PANI Nanocomposite and Study on its Photocatalytic Properties
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Effect of Expanded Temperature on Microstructure of Carbon Nanotubes/Expanded Graphite Composites
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Modification of Epoxy Asphalt by Hyperbranched Polyester
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Self-Healing Epoxy Composites – Part I: Curing Kinetics and Heat-Resistant Performance
p.383

Self-Healing Epoxy Composites – Part II: Healing Performance
p.387

The Annealing Behavior of cryoECAP Processed Pure Aluminum under High Magnetic Field
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Research on Synthetic Quartz Crystal Quality
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Fracture of a Finite Medium with a Circular Internal Crack under Hyperbolic Heat Conduction-Prescribed Crack Face Temperature
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 716Self-Healing Epoxy Composites – Part I: Curing...

Self-Healing Epoxy Composites – Part I: Curing Kinetics and Heat-Resistant Performance

Abstract:

This paper reports a study of self-healing epoxy composites. The healing agent was a two-component one synthesized in the authors laboratory, which consisted of epoxy-loaded urea-formaldehyde microcapsules as the polymerizable binder and CuBr₂(2-MeIm)₄ (the complex of CuBr₂ and 2-methylimidazole) as the latent hardener. Both the microcapsules and the matching catalyst were pre-embedded and pre-dissolved in the composites matrix cured by 2-ethyl-4-methylimidazole (2E4MIm), respectively. The data of curing kinetics show that the latent hardener CuBr₂(2-MeIm)₄ is not affected during the curing process of 2 h at 80°C, 2 h at 120°C and 2 h at 140°C, and heat deformation temperature of composites consisting of 2 wt% CuBr₂(2-MeIm)₄ and 5 wt% mcirocapsules cured at the same curing process is 180.2°C.