Polymer Substrates for Flexible Electronics: Achievements and Challenges

Iryna Yakimets; Duncan MacKerron; Peter Giesen; Keith J. Kilmartin; Marloes Goorhuis; Erwin Meinders; William A. MacDonald

doi:10.4028/www.scientific.net/AMR.93-94.5

Paper Titles

Committees

Preface

Cyclodextrins in Textile Finishing: Fixation and Analysis
p.1

Polymer Substrates for Flexible Electronics: Achievements and Challenges
p.5

Photon Interaction in Borate Glass System Containing Bi₂O₃, PbO and BaO at 60 keV: Theoretical Calculation
p.9

Bimetallic Group 6 Tricarbonyls Triply-Bridged by Bis(phenylthio)alkane Bidentate Ligands
p.13

Study of Carboxymethyl Cellulose from Papaya Peels as Binder in Ceramics
p.17

Comparison of TiO₂/RH-MCM-41 and TiO₂/TEOS-MCM-41 Hybrid Catalysts in Characteristics and Photodegradation of Tetramethylammonium
p.22

Synthesis of Superhydrophobic Raspberry-Like Polymethylmethacrylate/Silica Core/Shell Particles
p.27

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 93-94Polymer Substrates for Flexible Electronics:...

Polymer Substrates for Flexible Electronics: Achievements and Challenges

Abstract:

Flexible electronics technology can potentially result in many compelling applications not satisfied by the rigid Si-based conventional electronics. Commercially available foils such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) have emerged as the most suitable polymer materials for wide range of flexible electronics applications. Despite the enormous progress which has been recently done on the optimization of physical and mechanical properties of PET and PEN foils, their dimensional stability at the micro-scale is still an issue during patterning of wiring by means of lithography. Consequently, the measurement of in-plane micro-deformation of foil is of great importance for understanding and predicting its thermal, hydroscopic and mechanical behaviour during processing.

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Periodical:

Advanced Materials Research (Volumes 93-94)

Pages:

5-8

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.93-94.5

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Online since:

January 2010

Authors:

Iryna Yakimets, Duncan MacKerron, Peter Giesen, Keith J. Kilmartin, Marloes Goorhuis, Erwin Meinders, William A. MacDonald

Keywords:

Coefficient of Thermal Expansion, Dimensional Stability, Refractive Index

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