Distribution & Access For Publication Downloads News About Us Contact Us
Paper Titles
Fatigue Crack Growth on FSW AA2024-T3 Aluminum Joints
p.126
Delamination-Crater Interaction in Damage of Glass/Epoxy Composite Plates Subjected to Impact Fatigue
p.139
Researches Concerning Structural and Mechanical Behavior of Sandwich Composite Polymeric Products
p.151
Structural and Mechanical Characterization of Stainless Steel Joints Realized by CMT Process
p.161
Applying of Integral Equation of Volterra for Determining the Section Forces in Composite Beam, Regarding Shrinkage of Concrete
p.173
An Analytical-Numerical Approach Concerning the Stresses and Deformations in Single-Strapped Adhesively Bonded Joints
p.187
3D Adaptive Remeshing Procedure and its Application to Large Deformation Problems
p.199
Development of an Adhesion Test for Characterizing the Interface Fiber/Polymer Matrix
p.210
Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials
p.219

Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials

Article Preview

Abstract:

Solder materials are critical packaging compounds and due to usually weakest melting temperature among packaging constitutive materials, thus, they are frequently subjected to a multitude of physical phenomena: creep, fatigue and combined hardening effects. The complexity and interaction of such factors must be considered in suitable way in the mechanical behavior modeling using the appropriate material behavior laws. The choice of the mechanical model depends on several factors such as the complexity of constitutive equations to be integrated, the availability and suitability of implementation in the FE codes, the number of parameters to be identified, the capability of the model to represent the most common physical features of the material… Following these observations and in order to deal with these critical remarks, comparisons between the most common unified viscoplastic models should be done in the local and finite element levels for the decision upon the most efficient model. That is the aim of this paper with application to a tin based solder token as the test material.

You might also be interested in these eBooks
Behaviour of Material and Composite Structures View Preview

Info:

Periodical:

Key Engineering Materials (Volume 498)

Pages:

219-226

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.498.219

Citation:

Cite this paper

Online since:

January 2012

Authors:

S. Msolli, Olivier Dalverny, Joel Alexis, Moussa Karama

Keywords:

Finite Element Method (FEM), Hardening, Hysteresis Loop, Jump Tests, Solders, Thermal Cycling, Thermomechanical, Viscoplasticity

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

References

[1] Z.N. Cheng, G.Z. Wang, L. Chen, J. Wilde, K. Becker, Soldering & Surface Mount Technology, Vol 12, No. 2 (2000), pp.31-36.

Google Scholar

[2] G. Z. Wang, Z. N. Cheng, K. Becker, J. Wilde, Journal of Electronic Packaging, Vol. 123 (2001), pp.247-253.

Google Scholar

[3] McDowell, D.L. International Journal of Plasticity, Vol. 8, (1992), pp.695-728.

Google Scholar

[4] Gomez, J., Basaran, C., Mechanics of Materials Vol. 38, (2006), pp.585-598.

Google Scholar

[5] A.H. Zhao, C.L. Chow, Finite Elements in Analysis and Design Vol. 43 (2007), pp.681-690.

Google Scholar

[6] P. Chellapandi, R. S. Alwar, Int. J. Num. Meth. Eng. Vol. 43, (1998), pp.621-654.

Google Scholar

[7] Yi-Shao Lai, T. H. Wang, Microelectronics Reliability, Vol. 45 (2005), pp.575-582.

Google Scholar

[8] J. Gomez, C. Basaran, Int. J. Solids and Structures, Vol. 43 (2006), pp.1505-1527.

Google Scholar

[9] Stouffer, D.C. and Dame L.T. : Inelastic Deformation Of Metals: Models, Mechanical properties and metallurgy, (New York 1996).

Google Scholar

[10] L., Anand, J. Plasticity, Vol. 1, (1985) p.213–231.

Google Scholar

[11] S. Wippler, M. Kuna, Engineering Fracture Mechanics, Vol. 75 (2008) p.3534–3544.

DOI: 10.1016/j.engfracmech.2007.03.046

Google Scholar

[12] Ning Bai, Xu Chen, Int. J. Plasticity, Vol 25. No. 11. (2009), pp.2181-2203.

Google Scholar

[13] J. C. Moosbrugger, D. L. McDowell, J. Mech. Phys. Solids, Vol. 38. No. 5. (1990), pp.627-656.

Google Scholar

[14] Fu, C., McDowell, D.L. and Ume, I. C, J. Electron. Packag, Vol 120, (1998), pp.24-34.

Google Scholar

[15] Krausz, A. S., Krausz, K., Unified constitutive laws of plastic deformation. (California 1996).

DOI: 10.1016/b978-012425970-6/50006-0

Google Scholar

Scientific.Net is a registered brand of Trans Tech Publications Ltd
© 2024 by Trans Tech Publications Ltd. All Rights Reserved