Micromachining of Novel SiC on Si Structures for Device and Sensor Applications

Christian Förster; Volker Cimalla; M. Stubenrauch; Carsten Rockstuhl; Klemens Brueckner; Matthias A. Hein; J. Pezoldt; Oliver Ambacher

doi:10.4028/www.scientific.net/MSF.527-529.1111

Paper Titles

Selectivity and Residual Damage of Colloidal Silica Chemi-Mechanical Polishing of Silicon Carbide
p.1095

Augmented CMP Techniques for Silicon Carbide
p.1099

Characterization of Low Stress, Undoped LPCVD Polycrystalline SiC Films for MEMS Applications
p.1103

Mechanical Testing of Flexible Silicon Carbide Interconnect Ribbons
p.1107

Micromachining of Novel SiC on Si Structures for Device and Sensor Applications
p.1111

Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures Using a Time-Multiplexed Etch-Passivate Process
p.1115

Via Hole Formation in Silicon Carbide by Laser Micromachining
p.1119

Development of a Microstrip SiC MMIC Process
p.1123

Energy Efficiency: The Commercial Pull for SiC Devices
p.1129

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Micromachining of Novel SiC on Si Structures for Device and Sensor Applications

Abstract:

In this paper the multifariousness of SiC/Si heterostructures for device and sensor applications will be demonstrated. 3C-SiC based microelectromechanical resonator beams (MEMS) with different geometries actuated by the magnetomotive effect operating under ambient conditions were fabricated. The resonant frequency reaches values up to 2 MHz. The applications of these resonators are the measurement of the viscosity of liquids or mass detection. Furthermore, photonic devices in the form of SiC/Si infrared gratings for wavelength and polarization filters in infrared spectra are processed. SiC wear protection for a dosing system with the possibility to dose nano- or picoliter droplets of water based liquids as well as SiC nanomasking for catalytic agent nanostructures are demonstrated.