The Effect of Lattice Strain on the Step Edge Diffusion and Morphological Development during Epitaxial Growth
p.3463
p.3463
Evaluation of Interface Strength between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the Basis of Fracture Mechanics Concept
p.3469
p.3469
TiNi Thin Films for Microactuators and Microdevices: Sputter Deposition and Processing Techniques
p.3475
p.3475
The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films
p.3481
p.3481
Near-Zero-Thickness Self-Assembled Molecular Layers for Future Device Structures: Interfacial Adhesion and Diffusion Barrier Properties
p.3487
p.3487
Thermally Activated Flux Creep in High Tc Superconductors
p.3493
p.3493
Improved-Trapped Magnetic Fields in Top Seeded Melt Grown YBCO Superconductor Doped with Depleted and Enriched Uranium Oxide
p.3499
p.3499
Metallic Buffer Layers for Y-123 Coated Conductor
p.3505
p.3505
Copper and CuNi Alloys Substrates for HTS Coated Conductor Applications Protected from Oxidation
p.3511
p.3511
Near-Zero-Thickness Self-Assembled Molecular Layers for Future Device Structures: Interfacial Adhesion and Diffusion Barrier Properties
Abstract:
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Info:
Periodical:
Materials Science Forum (Volumes 426-432)
Pages:
3487-3492
Citation:
Online since:
August 2003
Authors:
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