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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022
May 01, 2023 EDT
Board Level Reliability of Flipchip Package
Nishant Lakhera
,
Mollie Benson
,
Andrew Mawer
,
Flip Chip Package
Solder Joint Reliability
Lead Free Solder Alloys
Board Level Temperature Cycling
Board Level Drop
•
https://doi.org/10.4071/001c.74741
IMAPSource Conference Papers
Lakhera, Nishant, Mollie Benson, and Andrew Mawer. 2023. “Board Level Reliability of Flipchip Package.”
IMAPSource Proceedings
2022 (IMAPS Symposium): 000211–16.
https://doi.org/10.4071/001c.74741
.
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