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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Silicon Wafer Integrated Fan-out Technology
Curtis Zwenger
,
George Scott
,
Ron Huemoeller
,
WonChul Do
,
WonGeol Lee
,
JiHun Yi
,
Silicon Wafer
Fan-out
FOWLP
•
https://doi.org/10.4071/2017DPC-TP2_Presentation4
IMAPSource Conference Papers
Zwenger, Curtis, George Scott, Ron Huemoeller, WonChul Do, WonGeol Lee, and JiHun Yi. 2017. “Silicon Wafer Integrated Fan-out Technology.”
IMAPSource Proceedings
2017 (DPC): 1–23.
https://doi.org/10.4071/2017DPC-TP2_Presentation4
.
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