Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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Fabrication of Single Crystal Silicon Micro-Tensile Test Specimens and Thin Film Aluminum Markers for Measuring Tensile Strain Using MEMS Processes

MEMS 공정을 이용한 단결정 실리콘 미세 인장시편과 미세 변형 측정용 알루미늄 Marker의 제조

  • 박준식 (전자부품연구원 나노메카트로닉스 연구센터) ;
  • 전창성 (전자부품연구원 나노메카트로닉스 연구센) ;
  • 박광범 (전자부품연구원 나노메카트로닉스 연구센) ;
  • 윤대원 (전자부품연구원 나노메카트로닉스 연구센) ;
  • 이형욱 (한국생산기술연구원 생산공정기술본) ;
  • 이낙규 (한국생산기술연구원 생산공정기술본) ;
  • 이상목 (한국생산기술연구원 생산공정기술본) ;
  • 나경환 (한국생산기술연구원 생산공정기술본) ;
  • 최현석 (한양대학교 기계공학과)
  • Published : 2004.06.01
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Abstract

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

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References

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