[H-7-3] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI

A. Noriki¹, K. W. Lee¹, J. Bea¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.H-7-3