Analysis of Cell to Module Loss Factor for Shingled PV Module

Sanchari Chowdhury; Eun-Chel Cho; Younghyun Cho; Youngkuk Kim; Junsin Yi

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Sanchari Chowdhury (Sungkyunkwan University)
Eun-Chel Cho (Sungkyunkwan University)
Younghyun Cho (Sungkyunkwan University)
Youngkuk Kim (Sungkyunkwan University)
Junsin Yi (Sungkyunkwan University)

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Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

#Shingled module #CTM analysis #Cell interconnection #Cell spacing #Encapsulant